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#2108: Cutting Silicon Wafer and Sapphire Wafer by CSB-060060 Fiber Laser Cutting Machine4
Laser Life Company 1F., No. 24, Gongye E. 4th Rd., Science-Based Industrial Park, Hsinchu 300, TAIWAN
CSB-060060-Q series Fiber Laser Cutting Machine(QCW 300W Fiber Laser Inside, High Precision Ball-Screw, Working Area: 060 x 060 cm)Cutting Si Wafer by QCW fiber LaserCutting Sapphire Wafer by QCW fiber LaserFor details, please contact our sales people or visit following link : CSB-060060-Q Fiber Laser Cutting System (laserlife-ezlaser.com) https://www.laserlife.com.tw/hot_402445.html #2108: Cutting Silicon Wafer and Sapphire Wafer by CSB-060060 Fiber Laser Cutting Machine 2021-09-30 2022-09-30
Laser Life Company 1F., No. 24, Gongye E. 4th Rd., Science-Based Industrial Park, Hsinchu 300, TAIWAN https://www.laserlife.com.tw/hot_402445.html
Laser Life Company 1F., No. 24, Gongye E. 4th Rd., Science-Based Industrial Park, Hsinchu 300, TAIWAN https://www.laserlife.com.tw/hot_402445.html
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2021-09-30 http://schema.org/InStock $NT 0 https://www.laserlife.com.tw/hot_402445.html